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Used Books

Patents and Publications of
Harvey Pinder

Patent Clipart


  • Chemical Mechanical Polishing (CMP) Polishing Solution with Enhanced Performance; U.S. Patent No. 8,597,539 and International Patent No. PCT/EP2009/062578

  • Recovery Device for Polishing Agent and De-Ionized Water for a Polishing Machine; U.S. Patent No. 5,895,315 / Taiwan Patent No. 335054

  • Single Component Pad Backer for Orbital Polishing Machine; U.S. Patent Application No. 20050277376

Publish Clipart


  • Co-Author; Improving Cost of Ownership and Performance of CMP Process and Consumables; published in Micro Magazine Technical Viewpoint 2004

  • Co-Author; Reduced Slurry Usage Process with Hard-Porous Pads; CMPMIC 2004

  • Co-Author; Evaluation of TWI STT711™ ¼ Inch Groove Pad For WCMP at TSMC Fab 3; presented at CMPMIC 2004 and published in VMIC 2004

  • Co-Author; Process and Yield Improvement by Changing Consumables in Tungsten CMP; CMPMIC 2003

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